Chapters authored
Boiling Heat Transfer on the Micro-Textured Interfaces
Higher heat flux than its normal criticality from high-power transistors, LIDAR (Laser Imaging Detection and Ranging), stacked CPUs, high-power transistors, and lasers must be efficiently transferred to cooling media through the metallic interface. The micro-/nano-textured aluminum and copper devices were highlighted among several approaches and fabricated to enhance the boiling heat transfer process to the subcooled water. The plasma printing was proposed to fabricate a pure aluminum device with concave micro-textures and to describe the boiling heat transfer behavior with comparison to the bare aluminum plate. A copper device was wet-plated to have convex micro-textures and to discuss the effect of micro-textures on the heat transfer characteristics under the forced water cooling by varying the Reynolds number. The boiling curve on the micro-textured interfaces was newly constructed by improving the boiling heat transfer process by micro-/nano-texturing.
Part of the book: Heat Transfer
Heat Transportation by Acicular Micro-Textured Device with Semi-Regular Alignment
Heat transportation device was developed to improve the cooling capacity through the heat convection process and to make low-temperature radiation from the heat source to the objective body in vacuum. This device consisted of the metallic substrate and the acicular micro−/nano-textures in semi-regular alignment. The micro-cone unit cell size and pitch in these textures was controllable by tuning the total current and the current density in the electrochemical processing. Four devices with various unit cell sizes and pitches were prepared for geometric characterization by SEM (Scanning Electron Miscopy) and for spectroscopic analyses on the IR-emittance by FT-IR (Fourier Transform-InfraRed) spectroscopy. Heat radiation experiment was performed to describe the heat transportation in vacuum from the heat source at 323 K to the objective plate. The texture size effect on the low-temperature heat radiation was investigated to build up a physical model for this heat radiation device. Heat convection experiment was also performed to describe the cooling capacity of device under the forced air flow. The unit cell height effect on the cooling behavior was discussed to deduce the physical model for this heat convection device. These models were considered to be used in the computational fluid mechanics simulations.
Part of the book: Heat Transfer